Ultra low k plasma enhanced chemical vapor deposition...

Ultra thin oxynitride and nitride/oxide stacked gate...

Ultra thin TCS (SiCl4) cell nitride for DRAM capacitor with...

Ultra-thin gate oxide formation using an N2O plasma

Ultra-thin resist coating quality by increasing surface...

Ultra-thin SiO2using N2O as the oxidant

Ultralow dielectric constant material as an intralevel or...

Ultralow dielectric constant material as an intralevel or...

Ultrasonic spray coating of liquid precursor for low K...

Ultrathin deposited gate dielectric formation using...

Ultrathin oxide films on semiconductors

Ultraviolet assisted porogen removal and/or curing processes...

Uniform dielectric film deposition on textured surfaces

Uniform distribution of reactants in a device layer

Uniform nonconformal deposition for forming low dielectric const

Unique .alpha.-C:N:H/.alpha.-C:N.sub.x film liner/barrier to pre

Use of a biased precoat for reduced first wafer defects in...

Use of a plasma source to form a layer during the formation...

Use of cyclic siloxanes for hardness improvement of low k...

Use of enhanced turbomolecular pump for gapfill deposition...