ALD of metal silicate films

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S786000, C427S255393, C427S255700, C257SE21625, C257SE21639

Reexamination Certificate

active

07972977

ABSTRACT:
Methods for forming metal silicate films are provided. The methods comprise contacting a substrate with alternating and sequential vapor phase pulses of a silicon source chemical, metal source chemical, and an oxidizing agent, wherein the metal source chemical is the next reactant provided after the silicon source chemical. Methods according to some embodiments can be used to form silicon-rich hafnium silicate and zirconium silicate films with substantially uniform film coverages on substrate surface.

REFERENCES:
patent: 3405801 (1968-10-01), Zwiacher et al.
patent: 4058430 (1977-11-01), Suntola et al.
patent: 4477296 (1984-10-01), Nair
patent: 4486487 (1984-12-01), Skarp
patent: 4747367 (1988-05-01), Posa
patent: 4761269 (1988-08-01), Conger et al.
patent: 5071670 (1991-12-01), Kelly
patent: 5294286 (1994-03-01), Nishizawa et al.
patent: 5306666 (1994-04-01), Izumi
patent: 5320719 (1994-06-01), Lasbmore et al.
patent: 5449314 (1995-09-01), Meikle et al.
patent: 5453494 (1995-09-01), Kirlin et al.
patent: 5610106 (1997-03-01), Foster et al.
patent: 5625217 (1997-04-01), Chau et al.
patent: 5711811 (1998-01-01), Suntola et al.
patent: 5731634 (1998-03-01), Matsuo et al.
patent: 5769950 (1998-06-01), Takasu et al.
patent: 5783478 (1998-07-01), Chau et al.
patent: 5795495 (1998-08-01), Meikle
patent: 5865365 (1999-02-01), Nishikawa et al.
patent: 5916365 (1999-06-01), Sherman
patent: 5939334 (1999-08-01), Nguyen et al.
patent: 6006763 (1999-12-01), Mori et al.
patent: 6033584 (2000-03-01), Ngo et al.
patent: 6066533 (2000-05-01), Yu
patent: 6066892 (2000-05-01), Ding et al.
patent: 6090666 (2000-07-01), Ueda et al.
patent: 6124189 (2000-09-01), Watanabe et al.
patent: 6130123 (2000-10-01), Liang et al.
patent: 6153935 (2000-11-01), Edelstein et al.
patent: 6166417 (2000-12-01), Bai et al.
patent: 6174799 (2001-01-01), Lopatin et al.
patent: 6174809 (2001-01-01), Kang et al.
patent: 6200893 (2001-03-01), Sneh
patent: 6225168 (2001-05-01), Gardner et al.
patent: 6265258 (2001-07-01), Liang et al.
patent: 6291282 (2001-09-01), Wilk et al.
patent: 6294836 (2001-09-01), Paranjpe et al.
patent: 6303500 (2001-10-01), Jiang et al.
patent: 6323131 (2001-11-01), Obeng et al.
patent: 6329704 (2001-12-01), Akatsu et al.
patent: 6342277 (2002-01-01), Sherman
patent: 6346151 (2002-02-01), Jiang et al.
patent: 6362526 (2002-03-01), Pramanick et al.
patent: 6365502 (2002-04-01), Paranjpe et al.
patent: 6368954 (2002-04-01), Lopatin et al.
patent: 6368961 (2002-04-01), Lopatin et al.
patent: 6373111 (2002-04-01), Zheng et al.
patent: 6383879 (2002-05-01), Kizilyalli et al.
patent: 6399522 (2002-06-01), Tsan et al.
patent: 6407435 (2002-06-01), Ma et al.
patent: 6433432 (2002-08-01), Shimizu
patent: 6444868 (2002-09-01), Vaughn et al.
patent: 6458695 (2002-10-01), Lin et al.
patent: 6482262 (2002-11-01), Elers et al.
patent: 6482740 (2002-11-01), Soininen et al.
patent: 6506676 (2003-01-01), Park et al.
patent: 6511876 (2003-01-01), Buchanan et al.
patent: 6518106 (2003-02-01), Ngai et al.
patent: 6534395 (2003-03-01), Werkhoven et al.
patent: 6537901 (2003-03-01), Cha et al.
patent: 6548886 (2003-04-01), Ikari et al.
patent: 6579767 (2003-06-01), Park et al.
patent: 6596576 (2003-07-01), Fu et al.
patent: 6613695 (2003-09-01), Pomarede et al.
patent: 6627503 (2003-09-01), Ma et al.
patent: 6686271 (2004-02-01), Raaijmakers et al.
patent: 6696332 (2004-02-01), Visokay et al.
patent: 6700771 (2004-03-01), Bhattacharyya
patent: 6703708 (2004-03-01), Werkhoven et al.
patent: 6709989 (2004-03-01), Ramdani et al.
patent: 6713846 (2004-03-01), Senzaki
patent: 6714435 (2004-03-01), Dimmler et al.
patent: 6717226 (2004-04-01), Hegde et al.
patent: 6723581 (2004-04-01), Chabal et al.
patent: 6730163 (2004-05-01), Vaartstra
patent: 6730588 (2004-05-01), Schinella
patent: 6780704 (2004-08-01), Raaijmakers et al.
patent: 6800552 (2004-10-01), Elers et al.
patent: 6815354 (2004-11-01), Uzoh et al.
patent: 6858524 (2005-02-01), Haukka et al.
patent: 6933225 (2005-08-01), Werkhoven et al.
patent: 6955986 (2005-10-01), Li
patent: 6986914 (2006-01-01), Elers
patent: 7045406 (2006-05-01), Huotari et al.
patent: 7118779 (2006-10-01), Verghese et al.
patent: 2001/0003064 (2001-06-01), Ohto
patent: 2001/0018266 (2001-08-01), Jiang et al.
patent: 2001/0025999 (2001-10-01), Suguro
patent: 2001/0041250 (2001-11-01), Werkhoven et al.
patent: 2001/0052318 (2001-12-01), Jiang et al.
patent: 2002/0006468 (2002-01-01), Paranjpe et al.
patent: 2002/0008257 (2002-01-01), Barnak et al.
patent: 2002/0013487 (2002-01-01), Norman et al.
patent: 2002/0014634 (2002-02-01), Koyama et al.
patent: 2002/0027286 (2002-03-01), Sundararajan et al.
patent: 2002/0030235 (2002-03-01), Agarwal et al.
patent: 2002/0037615 (2002-03-01), Matsuo
patent: 2002/0096724 (2002-07-01), Liang et al.
patent: 2002/0102838 (2002-08-01), Paranjpe et al.
patent: 2002/0106536 (2002-08-01), Lee et al.
patent: 2002/0137317 (2002-09-01), Kaushik et al.
patent: 2002/0190302 (2002-12-01), Bojarczuk et al.
patent: 2003/0032281 (2003-02-01), Werkhoven et al.
patent: 2003/0049942 (2003-03-01), Haukka et al.
patent: 2003/0064607 (2003-04-01), Leu et al.
patent: 2003/0072975 (2003-04-01), Shero et al.
patent: 2003/0082296 (2003-05-01), Elers et al.
patent: 2003/0165615 (2003-09-01), Aaltonen et al.
patent: 2003/0201537 (2003-10-01), Lane et al.
patent: 2003/0232510 (2003-12-01), Buchanan et al.
patent: 2004/0036129 (2004-02-01), Forbes et al.
patent: 2004/0071878 (2004-04-01), Schuhmacher
patent: 2004/0106261 (2004-06-01), Huotari et al.
patent: 2004/0121616 (2004-06-01), Satta et al.
patent: 2004/0175928 (2004-09-01), Abell
patent: 2005/0009325 (2005-01-01), Chung et al.
patent: 2005/0212139 (2005-09-01), Leinikka
patent: 2005/0263803 (2005-12-01), Takayanagi
patent: 2005/0271812 (2005-12-01), Myo et al.
patent: 2005/0271813 (2005-12-01), Kher et al.
patent: 2006/0046384 (2006-03-01), Joo et al.
patent: 2006/0078679 (2006-04-01), Elers et al.
patent: 2006/0121733 (2006-06-01), Kilpela et al.
patent: 2006/0216932 (2006-09-01), Kumar et al.
patent: 2007/0014919 (2007-01-01), Hamalainen et al.
patent: 2007/0026654 (2007-02-01), Huotari et al.
patent: 2007/0036892 (2007-02-01), Haukka et al.
patent: 2007/0148347 (2007-06-01), Hatanpaa et al.
patent: 0469470 (1992-02-01), None
patent: 0511264 (1995-08-01), None
patent: 0854 505 (1998-07-01), None
patent: 0880168 (1998-11-01), None
patent: 1063687 (2000-12-01), None
patent: 2372042 (2002-08-01), None
patent: 2372043 (2002-08-01), None
patent: 2372044 (2002-08-01), None
patent: WO 93/10652 (1993-05-01), None
patent: WO 94/14198 (1994-06-01), None
patent: WO 00/03420 (2000-01-01), None
patent: WO 00/47404 (2000-08-01), None
patent: WO 00/47796 (2000-08-01), None
patent: WO 00/54320 (2000-09-01), None
patent: WO 00/61833 (2000-10-01), None
patent: WO 01/29280 (2001-04-01), None
patent: WO 01/29892 (2001-04-01), None
patent: WO 01/29893 (2001-04-01), None
patent: WO 01/40541 (2001-07-01), None
patent: WO 01/66832 (2001-09-01), None
patent: WO 01/99166 (2001-12-01), None
patent: WO 02/43115 (2002-05-01), None
patent: WO 02/50922 (2002-06-01), None
patent: WO 2004/064147 (2004-07-01), None
patent: WO 2004/114398 (2004-12-01), None
patent: WO 2005/113852 (2005-12-01), None
patent: WO 2005/113855 (2005-12-01), None
patent: WO 2005/117086 (2005-12-01), None
patent: WO 2007/043709 (2007-04-01), None
patent: WO 2008/011235 (2008-01-01), None
File History, U.S. Appl. No. 11/359,884, filed Feb. 21, 2006-ongoing, Kumar et al.
Delabie A, et al.“Atomic Layer Deposition of hafnium silicate gate dielectric layers”, Journal of Vacuum Science & Technology A (Vacuum, Surfaces, and Films) AIP for American Vacuum SOC. USA, vol. 25, No. 4, Jul. 2007, pp. 1302-1308, XP002472774 ISSN: 0734-2101, p. 1302, right-hand col., last paragraph—p. 1303, left-hand col., paragraph 1, p. 1304, left-hand col., last paragraph—right-hand col., paragraph 1.
Duenas et al, “Experimental investigation of the electrical properties of atomic layer deposited hafnium-rich silicate films on n-type silicon”, Journal of Applied P

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

ALD of metal silicate films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with ALD of metal silicate films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and ALD of metal silicate films will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2641373

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.