Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2006-08-29
2006-08-29
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S758000, C427S240000
Reexamination Certificate
active
07098152
ABSTRACT:
A liquid form adhesive system is provided for spin-coating on wafers and mounting to rigid carrier substrates to support thinning and backside processing. The liquid adhesive comprises about 30–35% of a rosin, between 5–10% of a thermoplastic urethane, a nonionic surfactant present between 1–3%, and a trace of an ultraviolet fluorescing dye. The entire system is dissolved in 50–65%, by weight, of a dual solvent mixture composed of dimethylacetamide and propylene glycol monomethyl ether. When the mixture is made to a specific viscosity, filtered, applied by a spin-coating method to the wafer frontside surface, and cured, the result is a uniform and smooth surface of defined thickness. When the coated wafer is mounted to a rigid substrate, it may be mechanically thinned to thicknesses down to and beyond 25 um, depending upon the wafer composition, diameter, and process. Once thinned, the adhesive is safe for backside processing and is dissolved away at completion to provide a thinned wafer that is clean and ready for final dicing or chipping operations.
REFERENCES:
patent: 3970494 (1976-07-01), Pritchard
patent: 4266334 (1981-05-01), Edwards et al.
patent: 5008213 (1991-04-01), Kolesar
patent: 5087517 (1992-02-01), Sagawa et al.
patent: 5268065 (1993-12-01), Grupen-Shemansky
patent: 5539013 (1996-07-01), Eckberg et al.
patent: 5635010 (1997-06-01), Pepe et al.
patent: 5688356 (1997-11-01), Sagiv
patent: 5759874 (1998-06-01), Okawa
patent: 5776799 (1998-07-01), Song et al.
patent: 6273984 (2001-08-01), Bourdelais et al.
patent: 6358354 (2002-03-01), Patil
patent: 6478918 (2002-11-01), Bennett et al.
patent: 6585821 (2003-07-01), Zhuang et al.
patent: 6630050 (2003-10-01), Moeller et al.
patent: 6869894 (2005-03-01), Moore
General Chemical Performance Products LLC
Ghyka Alexander
Plantamura Arthur J.
LandOfFree
Adhesive support method for wafer coating, thinning and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive support method for wafer coating, thinning and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive support method for wafer coating, thinning and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3709111