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Integrated circuit package system with multiple devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package system with offset stacking

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Integrated circuit package system with package substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Integrated circuit package system with pedestal structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Integrated circuit package system with pedestal structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Integrated circuit package system with planar interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Integrated circuit package system with rigid locking lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Integrated circuit package system with stiffener

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Integrated circuit package system with support structure for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit package system with support structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit package system with supported stacked die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit package system with thermo-mechanical...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit package that has a plurality of staggered pin

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Integrated circuit package which contains two in plane voltage b

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Integrated circuit package with a balanced-part structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Integrated circuit package with a capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Integrated circuit package with a plurality of vias that are ele

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Integrated circuit package with carbon nanotube array heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Integrated circuit package with chip-side signal connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Integrated circuit package with exposed die surfaces and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
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