Integrated circuit package with chip-side signal connections

Details Integrated circuit package with chip-side signal connections Integrated circuit package with chip-side signal connections

2004-03-05

2008-03-18

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S686000, C257S712000, C257S730000, C257SE23178

Reexamination Certificate

active

07345359

ABSTRACT:
Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.

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patent: 2004/0022038 (2004-02-01), Figueroa et al.
patent: 2004/0027813 (2004-02-01), Li
patent: 2004/0218372 (2004-11-01), Hamasaki et al.

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