Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-11-27
2007-11-27
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23110, C257SE23103, C257SE23145, C257SE23069, C257SE23165, C257SE23107, C257S713000, C257S717000, C257S720000, C257S706000, C257S704000, C257S707000, C264S171130, C264S108000, C264S148000, C264S104000, C264S437000, C264S211000, C438S122000, C438S125000, C427S180000
Reexamination Certificate
active
11044953
ABSTRACT:
An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat spreader. The integrated heat spreader is fixed on the substrate, and includes an inner face. The array of carbon nanotubes is formed on the inner face of the integrated heat spreader. Top and bottom ends of the carbon nanotubes perpendicularly contact the integrated heat spreader and the die respectively. Each carbon nanotube can be capsulated in a nanometer-scale metal having a high heat conduction coefficient.
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Chen Ga-Lane
Huang Chuan-De
Huang Wen-Jeng
Leu Charles
Lin Jhy-Chain
Hon Hai Precision Industry Co. Ltd.
Morris Manning & Martin LLP
Tingkang Xia, Esq. Tim
Williams Alexander Oscar
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