Integrated circuit package with a plurality of vias that are ele

Details Integrated circuit package with a plurality of vias that are ele Integrated circuit package with a plurality of vias that are ele

1995-12-20

1998-02-24

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257703, 257706, 257774, H01L 2312

Patent

active

057214549

ABSTRACT:
An integrated circuit package which has vias that provide the dual function of electrically grounding an integrated circuit and removing heat generated by the circuit. The package has a bonding shelf extending from a base portion. The bonding shelf has a plurality of bonding pads that are connected to corresponding pads on a top surface of the integrated circuit. The integrated circuit is mounted to the base portion of the package. The base portion has a plurality of surface pads that are connected to corresponding ground pads on the integrated circuit. Located between the base portion and an external bottom surface of the package is a ground bus. The package has a plurality of vias that electrically connect the surface pads and integrated circuit to the ground bus. The vias further extend to the external bottom surface to provide a thermal path between the integrated circuit and the outside of the package.

REFERENCES:
patent: 5543661 (1996-08-01), Sumida

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