Integrated circuit package with a balanced-part structure

Details Integrated circuit package with a balanced-part structure Integrated circuit package with a balanced-part structure

2007-02-13

2007-02-13

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S686000, C257S687000

Reexamination Certificate

active

10637045

ABSTRACT:
An integrated circuit package includes a balanced-part structure. The condition of thermal stress of chips connected on a substrate decides the amount, locations, weights, and the material of at least a balanced-part fastened on a substrate. The balanced-part is fastened on the substrate to balance stress distribution before an adhering heat sinks process and a packaging molding compound process. The balanced-part also decreases thermal stress affection and avoid warpage defects of the integrated circuit packages.

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patent: 2004/0065473 (2004-04-01), Chang et al.
patent: 2004/0212066 (2004-10-01), Wang

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