Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-01-04
2011-01-04
Soward, Ida M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S678000, C257S690000, C257S734000, C257S787000, C257S788000, C257S795000, C257S797000, C257SE21502, C257SE21503, C257SE21504, C257SE23070, C257SE23124, C257SE23127, C257SE23151, C257SE23175, C438S106000
Reexamination Certificate
active
07863726
ABSTRACT:
A method of manufacture of an integrated circuit package system includes: forming a package substrate with a top substrate side and a bottom substrate side; forming a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate; mounting an integrated circuit device over the top substrate side; connecting an electrical interconnect between the integrated circuit device and the top substrate side; and forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.
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Michael Kochanowski, Brian Toleno, Improved BGA shock and bend performance using corner glue epoxies, Global SMT & Packaging, Oct. 2006, pp. 26-36, vol. 6, No. 9, Trafalgar Publications Ltd, Glastonbury, United Kingdom.
Chow Seng Guan
Jang Tae Hoan
Ishimaru Mikio
Soward Ida M
Stats Chippac Ltd.
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