Integrated circuit package system with thermo-mechanical...

Details Integrated circuit package system with thermo-mechanical... Integrated circuit package system with thermo-mechanical...

2007-12-10

2010-02-02

Toledo, Fernando L (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23023, C257S777000, C257S785000, C438S109000

Reexamination Certificate

active

07656017

ABSTRACT:
An integrated circuit package system includes providing a plurality of substrates; inserting a receptor in one of the substrates, the receptor held in and not extending through the one of the substrates; inserting a conductive post in another of the substrates; mounting the one of the substrates and the another of the substrates over one another with the conductive post engaging the receptor to thermally interlock without a separate bonding material; and mounting an integrated circuit mounted on the one of the substrates or the another of the substrates.

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patent: 2007/0187818 (2007-08-01), Lyne
patent: 2007/0197099 (2007-08-01), DiStefano
patent: 2008/0253095 (2008-10-01), Baraton et al.

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