Integrated circuit package system with stiffener

Details Integrated circuit package system with stiffener Integrated circuit package system with stiffener

2006-07-10

2009-06-09

Toledo, Fernando L (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S706000, C257S713000, C438S122000

Reexamination Certificate

active

07545032

ABSTRACT:
An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle; soldering a stiffener structure; having an opening; on the mounting structure; connecting the stiffener structure to a ground; and molding the integrated circuit die and partially the stiffener structure through the opening.

REFERENCES:
patent: 6951776 (2005-10-01), Lo et al.
patent: 7025848 (2006-04-01), Wang
patent: 7045890 (2006-05-01), Xie et al.
patent: 7051311 (2006-05-01), Tomita et al.
patent: 2004/0125568 (2004-07-01), Tao
patent: 2007/0045824 (2007-03-01), Zhao et al.
patent: 2007/0108598 (2007-05-01), Zhong et al.
patent: 2007/0170554 (2007-07-01), Camacho et al.
patent: 2007/0241431 (2007-10-01), Manatad
patent: 2008/0001263 (2008-01-01), Dimaano et al.

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