Integrated circuit package with exposed die surfaces and...

Details Integrated circuit package with exposed die surfaces and... Integrated circuit package with exposed die surfaces and...

2006-09-19

2006-09-19

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S780000, C257S781000, C257S782000, C257S784000, C257S787000, C257S693000

Reexamination Certificate

active

07109574

ABSTRACT:
An integrated circuit (IC) device comprising: 1) an integrated circuit (IC) die having a first surface, a second surface opposite the first surface, and sidewalls extending between the first surface and the second surface; 2) an integrated circuit (IC) package for supporting the IC die, wherein the IC package is attached to at least one of the sidewalls of the IC die such that at least a portion of the IC die first surface and at least a portion of the IC die second surface are exposed; and 3) at least one auxiliary component attached to at least one of the exposed portion of the IC die first surface and the exposed portion of the IC die second surface.

REFERENCES:
patent: 6242932 (2001-06-01), Hembree
patent: 6429530 (2002-08-01), Chen
patent: 6534859 (2003-03-01), Shim et al.
patent: 6630371 (2003-10-01), Hembree
patent: 6661103 (2003-12-01), Akram

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