Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2008-03-26
2011-10-11
Sandvik, Benjamin (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S690000, C257SE23003, C257SE21511, C438S108000
Reexamination Certificate
active
08035211
ABSTRACT:
An integrated circuit package in package system including: providing a substrate; mounting a wire bonded die with an active side over the substrate; connecting the active side to the substrate with bond wires; mounting a structure over the wire bonded die having a wire-in-film adhesive between the structure and the wire bonded die and overhangs at ends of the structure between the wire-in-film adhesive and the substrate; mounting support structures at the overhangs between the wire-in-film adhesive and the substrate; and encapsulating the wire bonded die and the structure with an encapsulation.
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Ko Won-Jun
Park JoungUn
Yoon BoHan
Ishimaru Mikio
Sandvik Benjamin
Soderholm Krista
Stats Chippac Ltd.
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