Integrated circuit package system with multiple devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S666000, C257S673000, C257S676000, C257S686000, C257S777000, C257SE23031, C257SE23032, C257SE23052, C257SE21499, C438S106000

Reexamination Certificate

active

07919848

ABSTRACT:
An integrated circuit package system includes: forming a die-attach paddle, an outer interconnect, and an inner interconnect toward the die-attach paddle beyond the outer interconnect; mounting an integrated circuit device over the die-attach paddle; connecting the integrated circuit device to the inner interconnect and the outer interconnect; encapsulating the integrated circuit device over the die-attach paddle; attaching an external interconnect under the outer interconnect; and attaching a circuit device under the die-attach paddle and extended laterally beyond opposite sides of the die-attach paddle.

REFERENCES:
patent: 5646829 (1997-07-01), Sota
patent: 6462421 (2002-10-01), Hsu et al.
patent: 6603072 (2003-08-01), Foster et al.
patent: 6677663 (2004-01-01), Ku et al.
patent: 7023076 (2006-04-01), Khiang
patent: 7045887 (2006-05-01), Karnezos
patent: 7154186 (2006-12-01), Noquil et al.
patent: 7163842 (2007-01-01), Karnezos
patent: 7166494 (2007-01-01), Karnezos
patent: 7169642 (2007-01-01), Karnezos
patent: 2002/0163015 (2002-11-01), Lee et al.
patent: 2003/0020177 (2003-01-01), Oka
patent: 2003/0197290 (2003-10-01), Crowley et al.
patent: 2004/0159942 (2004-08-01), Kinsman
patent: 2004/0164382 (2004-08-01), Gerber et al.
patent: 2004/0251557 (2004-12-01), Kee
patent: 2005/0001294 (2005-01-01), Li et al.
patent: 2005/0001328 (2005-01-01), Tsai et al.
patent: 2006/0081967 (2006-04-01), Ha et al.
patent: 2006/0261453 (2006-11-01), Lee et al.

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