Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-04-05
2011-04-05
Lee, Eugene (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S666000, C257S673000, C257S676000, C257S686000, C257S777000, C257SE23031, C257SE23032, C257SE23052, C257SE21499, C438S106000
Reexamination Certificate
active
07919848
ABSTRACT:
An integrated circuit package system includes: forming a die-attach paddle, an outer interconnect, and an inner interconnect toward the die-attach paddle beyond the outer interconnect; mounting an integrated circuit device over the die-attach paddle; connecting the integrated circuit device to the inner interconnect and the outer interconnect; encapsulating the integrated circuit device over the die-attach paddle; attaching an external interconnect under the outer interconnect; and attaching a circuit device under the die-attach paddle and extended laterally beyond opposite sides of the die-attach paddle.
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Advincula Abelardo Jr Hadap
Bathan Henry Descalzo
Camacho Zigmund Ramirez
Tay Lionel Chien Hui
Gumedzoe Peniel M
Lee Eugene
Mikio Ishimaru
Stats Chippac Ltd.
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