Integrated circuit package system with pedestal structure

Details Integrated circuit package system with pedestal structure Integrated circuit package system with pedestal structure

2008-01-02

2010-02-02

Fahmy, Wael (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S686000, C257SE25027, C257S735000, C257SE23015

Reexamination Certificate

active

07656021

ABSTRACT:
An integrated circuit package system includes providing a substrate having a bond finger thereon and forming a pedestal on a portion of the bond finger. A first die is mounted on the substrate and adjacent to the bond finger. A portion of the first die, a portion of the bond finger, and a portion of the pedestal are embedded in an resin layer with an exposed portion of the pedestal protruding from the resin layer. A second die is mounted on the first die and electrically coupled to the exposed portion of the pedestal.

REFERENCES:
patent: 5710695 (1998-01-01), Manteghi
patent: 5787575 (1998-08-01), Banerjee et al.
patent: 5821614 (1998-10-01), Hashimoto et al.
patent: 5847455 (1998-12-01), Manteghi
patent: 6064113 (2000-05-01), Kirkman
patent: 6083776 (2000-07-01), Manteghi
patent: 6171888 (2001-01-01), Lynch et al.
patent: 6677663 (2004-01-01), Ku et al.
patent: 6762488 (2004-07-01), Maeda et al.
patent: 2004/0212088 (2004-10-01), Chen et al.

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