Integrated circuit package system with rigid locking lead

Details Integrated circuit package system with rigid locking lead Integrated circuit package system with rigid locking lead

2011-01-18

2011-01-18

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S670000, C257S701000, C257S702000, C257S787000, C257SE23034, C257SE23068, C257SE23086

Reexamination Certificate

active

07872345

ABSTRACT:
An integrated circuit package system includes: providing a protective layer having an opening; forming a conductive layer over the protective layer and filling the opening; patterning a rigid locking lead, having both a lead locking portion and a lead exposed portion, from the conductive layer; connecting an integrated circuit and the rigid locking lead; and forming an encapsulation over the integrated circuit with the lead locking portion in the encapsulation and the lead exposed portion exposed from the encapsulation.

REFERENCES:
patent: 6072239 (2000-06-01), Yoneda et al.
patent: 6528877 (2003-03-01), Ernst et al.
patent: 6635957 (2003-10-01), Kwan et al.
patent: 6770959 (2004-08-01), Huang et al.
patent: 6774499 (2004-08-01), Yang

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