Integrated circuit package system with support structure for...

Details Integrated circuit package system with support structure for... Integrated circuit package system with support structure for...

2011-08-02

2011-08-02

Mandala, Victor (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257SE21502, C257SE23024, C438S109000

Reexamination Certificate

active

07989941

ABSTRACT:
An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.

REFERENCES:
patent: 7327004 (2008-02-01), Hattori et al.
patent: 2006/0043559 (2006-03-01), Chow et al.
patent: 2006/0267173 (2006-11-01), Takiar et al.
patent: 2007/0287227 (2007-12-01), Huddleston et al.

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