Integrated circuit package system with planar interconnects

Details Integrated circuit package system with planar interconnects Integrated circuit package system with planar interconnects

2005-09-16

2011-11-29

Fahmy, Wael (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S666000, C257S686000, C257S693000, C257S777000, C257SE23011, C257SE23031, C438S109000, C438S112000

Reexamination Certificate

active

08067831

ABSTRACT:
An integrated circuit package system is provided including forming a first substrate, mounting a first integrated circuit to the first substrate, and forming first planar interconnects in contact with the first integrated circuit and electrically connecting the first integrated circuit to the first substrate.

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