LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Packaged microelectronic devices with a lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Packaged microelectronic devices with pressure release...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Packaged microelectronic elements with enhanced thermal conducti

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Packaged semiconductor device and a lead frame therefor, having

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device and a leadframe therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device having tab tape and particular pow

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device including multiple semiconductor c

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device utilizing leadframe attached on a

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Packaging high power integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Packaging of semiconductor chips with resin

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Packaging of semiconductor circuit in pre-molded plastic package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Packaging substrate comprising staggered vias

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Packaging system for field effects transistors

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Packing structure of semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Pad structures to improve board-level reliability of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Paddleless molded plastic semiconductor chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Palladium-spot leadframes for high adhesion semiconductor...