Packaged microelectronic devices with a lead frame

Details Packaged microelectronic devices with a lead frame Packaged microelectronic devices with a lead frame

2008-07-31

2009-11-03

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

C257S676000, C257S690000, C257S692000, C257S784000, C257SE23043, C257SE23052, C361S813000

Reexamination Certificate

active

07612436

ABSTRACT:
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.

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