Packaged semiconductor device and a lead frame therefor, having

Details Packaged semiconductor device and a lead frame therefor, having Packaged semiconductor device and a lead frame therefor, having

1992-12-10

1995-08-15

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257666, 257691, 257787, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054422337

ABSTRACT:
A lead frame for a semiconductor IC device has a pair of common elongated leads and first and second groups of slender leads arranged on opposite sides of the common elongated leads and generally extending transverse to the common elongated leads. The common elongated leads have as their integral parts slender leads extending therefrom generally transverse thereto and substantially linear extensions from both ends of the common elongated leads. The linear extensions serve to firmly support a semiconductor chip to be packaged along with parts of the leads. The common elongated leads may further have as their integral parts projections extending from their sides for enhancement of the heat dissipation capability. A semiconductor chip may have bonding pads arranged thereon such that bonding wires and the common elongated leads do not cross each other for electrical connection between the common elongated leads and bonding pads of the semiconductor chip.

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4916519 (1990-04-01), Ward
patent: 4965654 (1990-10-01), Karner et al.
patent: 4967261 (1990-10-01), Niki et al.
patent: 5068712 (1991-11-01), Murakami
patent: 5115298 (1992-05-01), Loh

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