4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
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Gravitationally assisted control of spread of viscous...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Grid array type lead frame having lead ends in different planes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Ground plane for exposed package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Ground plane for plastic encapsulated integrated circuit die pac

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Ground plane for plastic encapsulated integrated circuit die pac

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Ground-enhanced semiconductor package and lead frame for the...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Grounded embedded flip chip RF integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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