Packaged semiconductor device having tab tape and particular pow

Details Packaged semiconductor device having tab tape and particular pow Packaged semiconductor device having tab tape and particular pow

1992-09-14

1993-10-12

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, 257668, H01L 2348

Patent

active

052528537

ABSTRACT:
A packaged semiconductor device having an LOC structure, a thin body, and good electrical characteristics employs a TAB tape. A semiconductor chip carries ground pads arranged in a row, power pads arranged in another row, and signal pads arranged in two rows on both sides of the rows of ground and power pads. A shared ground lead and a shared power lead extend along and are connected to ground pads and power pads, respectively.

REFERENCES:
patent: 4916519 (1990-04-01), Ward
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5115298 (1992-05-01), Loh
patent: 5146312 (1992-09-01), Lim
patent: 5164815 (1992-11-01), Lim

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