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IC card including frame with lateral hole for injecting encapsul

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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IC carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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IC carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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IC chip package structure and underfill process

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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IC chip package with directly connected leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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IC having heat spreader attached by glob-topping

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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IC package encapsulating a chip under asymmetric single-side...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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IC packaging lead frame for reducing chip stress and deformation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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IC substrate having over voltage protection function

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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IC substrate with over voltage protection function

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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In-line apparatus and method for manufacturing double-sided...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Increased I/O leadframe and semiconductor device including same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Increasing the gap between a lead frame and a semiconductor die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Individualized low parasitic power distribution lines...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Inexpensive resin molded semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Injection of encapsulating material on a optocomponent

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Inkjet printed leadframes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Inlet for an electronic tag

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Inlet for an electronic tag

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Inline integrated circuit system

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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