Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate
2006-05-23
2006-05-23
Graybill, David E. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
C257S683000, C257S730000, C257S787000, C257S783000, C257S676000
Reexamination Certificate
active
07049685
ABSTRACT:
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In one aspect of the invention, a packaged microelectronic device includes a microelectronic die, an interconnecting unit coupled to the die, and a protective casing over the die. The interconnecting unit can have a substrate with a first side and a second side to which the die is attached, a plurality of contact elements operatively coupled to corresponding bond-pads on the die, and a plurality of ball-pads on the first side of the substrate electrically coupled to the contact elements. The protective casing can have at least a first cover encapsulating the die on the first side of the substrate. The packaged microelectronic device can also include a pressure relief element through at least a portion of the first cover and/or the substrate. The pressure relief element can have an opening to an external environment and a passageway to an internal location within the packaged microelectronic device. In operation, the pressure relief element releases gases or other forms of moisture entrapped by the casing and/or the substrate during high temperature processing of the packaged microelectronic device.
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patent:
Cobbley Chad A.
James Stephen L.
LandOfFree
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