Packaged semiconductor device including multiple semiconductor c

Details Packaged semiconductor device including multiple semiconductor c Packaged semiconductor device including multiple semiconductor c

1993-01-12

1994-12-13

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257776, 257773, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053731883

ABSTRACT:
A resin-molded multi-chip package semiconductor device includes a lead frame having a plurality of leads including crossing leads that extend over an obverse or a reverse side of one semiconductor element separated from electrical contact with the element by an interposed insulating material. The electrodes of one element and of another element are electrically connected in common to the crossing lead by bonding wires. The device may comprise a TAB tape having leads on an insulating tape, electrically connecting the electrodes of the neighboring elements together. The TAB tape may include crossing leads that cross another TAB lead.

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patent: 5245215 (1993-09-01), Sawaya
patent: 5245216 (1993-09-01), Sako

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