Palladium-spot leadframes for high adhesion semiconductor...

Details Palladium-spot leadframes for high adhesion semiconductor... Palladium-spot leadframes for high adhesion semiconductor...

2007-07-17

2007-07-17

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

C257S666000, C438S123000

Reexamination Certificate

active

11212828

ABSTRACT:
A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.

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