Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1995-06-07
1996-10-08
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257676, 257692, H01L 23495
Patent
active
055634435
ABSTRACT:
A packaged integrated circuit (10) includes a leadframe adhesively attached onto a semiconductor IC chip (11 ). The leadframe includes a pair of bus bars or support ties (14, 15), a pair of support tabs (22, 23) and a plurality of lead fingers (12, 13) for inputting and outputting signals. The support ties (14, 15) extend outside of the integrated circuit package during formation of the package on one end of the package only with each tie extending outside the package on the opposite end of the other. The support tabs (22, 23) are positioned linearly from the support ties (14, 15) on the end of the package which the respective tie does not extend to the outside of the package. The leadframe and the IC chip are connected by a plurality of sheets of insulating tape (16, 17), which have a recess or removed portion (31 ) at the location closer to the support ties (14, 15), to reduce the risk of delamination of the insulating tape and to increase the reliability of the packaged IC. Also, support ties (14, 15) include extensions (45) which extend into gaps between the lead fingers (12, 13).
REFERENCES:
patent: 5331201 (1994-07-01), Nishino
patent: 5442233 (1995-08-01), Anjoh et al.
Beng Lim T.
Ching Teo B.
Brady III W. James
Donaldson Richard L.
Mintel William
Potter Roy
Texas Instruments Incorporated
LandOfFree
Packaged semiconductor device utilizing leadframe attached on a does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaged semiconductor device utilizing leadframe attached on a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged semiconductor device utilizing leadframe attached on a will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-59637