Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate
2004-08-04
2008-11-04
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
C257S674000, C257S784000, C438S119000, C438S646000, C438S612000
Reexamination Certificate
active
07446399
ABSTRACT:
The present invention is directed to a new bonding pad structure having a rugged contact interface that makes it more difficult for a crack to grow from the peripheral edge of the bonding pad. The rugged contact interface also helps to accumulate more solder paste on the edge of the bonding pad, increase the thickness of the solder layer near the pad edge and prevent the pad edge from being oxidized and turning into a crack initiation point.
REFERENCES:
patent: 3462349 (1969-08-01), Gorgenyi
patent: 3541222 (1970-11-01), Parks et al.
patent: 4652336 (1987-03-01), Andrascek et al.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 5053851 (1991-10-01), Berndlmaier et al.
patent: 5059553 (1991-10-01), Berndlmaier et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5260518 (1993-11-01), Tanaka et al.
patent: 5261593 (1993-11-01), Casson et al.
patent: 5317801 (1994-06-01), Tanaka et al.
patent: 5401913 (1995-03-01), Gerber et al.
patent: 5491303 (1996-02-01), Weiss
patent: 5600884 (1997-02-01), Kondo et al.
patent: 5648686 (1997-07-01), Hirano et al.
patent: 5663594 (1997-09-01), Kimura
patent: 5726497 (1998-03-01), Chao et al.
patent: 5757078 (1998-05-01), Matsuda et al.
patent: 5783868 (1998-07-01), Galloway
patent: 5872399 (1999-02-01), Lee
patent: 5943597 (1999-08-01), Kleffner et al.
patent: 6198169 (2001-03-01), Kobayashi et al.
patent: 6245594 (2001-06-01), Wu et al.
patent: 6303985 (2001-10-01), Larson et al.
patent: 6306750 (2001-10-01), Huang et al.
patent: 6329722 (2001-12-01), Shih et al.
patent: 6400018 (2002-06-01), Clatanoff et al.
patent: 6434817 (2002-08-01), Feigenbaum et al.
patent: 6462414 (2002-10-01), Anderson
patent: 6596560 (2003-07-01), Hsu
patent: 6762503 (2004-07-01), Lee
patent: 6794745 (2004-09-01), Lee
patent: 6872465 (2005-03-01), Soga et al.
patent: 6906417 (2005-06-01), Jiang et al.
patent: 7012018 (2006-03-01), Tellkamp
patent: 7015580 (2006-03-01), Fitzsimmons et al.
patent: 7331106 (2008-02-01), Workman et al.
patent: 2002/0047216 (2002-04-01), Jiang et al.
patent: 2002/0171157 (2002-11-01), Soga et al.
patent: 2003/0119299 (2003-06-01), Jiang et al.
patent: 2006/0097400 (2006-05-01), Cruz et al.
patent: 19702014 (1998-04-01), None
patent: 0702404 (1996-03-01), None
patent: 0751565 (1997-01-01), None
patent: 56-66057 (1981-06-01), None
patent: 1120040 (1989-05-01), None
patent: 2-288925 (1990-11-01), None
patent: 6-112274 (1994-04-01), None
patent: 9-266230 (1997-10-01), None
patent: 2001-351946 (2001-12-01), None
patent: WO 92/00604 (1992-01-01), None
patent: WO 00/13232 (2000-03-01), None
Altera Corporation
Morgan & Lewis & Bockius, LLP
Morris Francis E.
Rao Steven H
Weiss Howard
LandOfFree
Pad structures to improve board-level reliability of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Pad structures to improve board-level reliability of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pad structures to improve board-level reliability of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4039257