Packaging system for field effects transistors

Details Packaging system for field effects transistors Packaging system for field effects transistors

1995-12-08

1999-06-29

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257723, 257685, 257678, H01L 23495, H01L 2352, H01L 2334

Patent

active

059172363

ABSTRACT:
A packaging system for field effect transistor ("FET") dies is described. Individual FET dies are eutectically bonded to individual FET mounting bars. The mounting bar/FET die combination is then eutectically bonded, along with the other components comprising the package, to a package base. After a wiring operation, the package is completed by sealing it with a cover. This packaging system has many fewer parts than known FET packages, permits the economical correction of micro-voids between the FET dies and the mounting bars, and is significantly less expensive than known FET packages.

REFERENCES:
patent: 5243218 (1993-09-01), Zenitani et al.
patent: 5470787 (1995-11-01), Greer
patent: 5637913 (1997-06-01), Kajihara et al.

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