Packaging of semiconductor circuit in pre-molded plastic package

Details Packaging of semiconductor circuit in pre-molded plastic package Packaging of semiconductor circuit in pre-molded plastic package

1997-09-26

1999-02-09

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257673, 257674, 257675, 257676, 257688, 257706, H01L 23495

Patent

active

058698833

ABSTRACT:
An inexpensive pre-molded package for electronic semiconductor circuit with increased thermal extraction capability, improved electrical performance, improved dielectric constant of sealing medium, optically transmissive sealing lid, and partially reduced electromagnetic radiation. In one embodiment, the pre-molded package includes electronic semiconductor circuit, a plurality of electrically conductive leads, a heat spreader, a plurality of electrically conductive bond wires, and a seal lid. Preferably, a surface of the heat spreader remains exposed to the exterior of the pre-molded package. In another embodiment, the pre-molded package includes a semiconductor circuit, a plurality of electrically conductive leads, a heat spreader, a plurality of electrically conductive bond wires, and an optically transmissive seal lid.

REFERENCES:
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patent: 4809053 (1989-02-01), Kuraishi
patent: 5057903 (1991-10-01), Olla
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patent: 5483098 (1996-01-01), Joiner, Jr.
patent: 5485037 (1996-01-01), Marrs
patent: 5491362 (1996-02-01), Hamzehdoost et al.
patent: 5598034 (1997-01-01), Wakefield

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