Packaging of semiconductor chips with resin

Details Packaging of semiconductor chips with resin Packaging of semiconductor chips with resin

1991-04-24

1994-02-22

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257692, 257787, H01L 2328

Patent

active

052890333

ABSTRACT:
A semiconductor device is fabricated by placing a semiconductor chip in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers. Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mold surrounding the chip. Furthermore, the mold has horizontal movement restricting projections to limit vertical movement of the chip within the mold cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.

REFERENCES:
patent: 3802069 (1974-04-01), Thompson
patent: 4012766 (1977-03-01), Phillips et al.
patent: 4069924 (1978-01-01), McCorkle
patent: 4255851 (1981-03-01), Fortuna
patent: 4330790 (1982-05-01), Burns
patent: 4331740 (1982-05-01), Burns
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 4806409 (1989-02-01), Walter et al.
patent: 4812421 (1989-03-01), Jung et al.
patent: 4884124 (1989-11-01), Mori et al.
patent: 4924291 (1990-05-01), Lesk et al.
patent: 5018003 (1991-05-01), Yasunaga et al.

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