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Heat dissipating wiring board and method for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Heat dissipation semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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Heat radiative electronic component

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Heat sink bonded to a die paddle having at least one aperture

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Heat sink for semiconductor device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Heat sink packaging assembly for electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Heat spreader for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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Heat spreader hole pin 1 identifier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Heat spreader structures in scribe lines

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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Heat spreader suitable for use in semiconductor packages having

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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Heatsink for surface mount device for circuit board mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Hermetically sealed ceramic integrated circuit heat dissipating

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Hermetically sealed integrated circuit lead-on package configura

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Heterogeneous integrated high voltage DC/AC light emitter

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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High aspect ratio integrated circuit chip and method for produci

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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High bond line thickness for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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High current capacity semiconductor device housing

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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High current semiconductor device package with plastic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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High density chip scale leadframe package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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High density chip scale leadframe package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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