Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1997-10-31
2000-10-03
Graybill, David E.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257706, 257713, 257737, 257738, 257784, 257796, H01L 2310, H01L 2334, H01L 2348, H01L 2328
Patent
active
06127724&
ABSTRACT:
A semiconductor chip is mounted in face-up disposition on a dielectric element, with thermally conductive but flexible elements disposed between the chip bottom surface and the top surface of the dielectric element so as to provide a compliant but thermally conductive path from the chip to a substrate which is bonded to the terminals. A spreader having coefficient of thermal expansion substantially equal to that of the chip overlies the front surface and constrains an encapsulant surrounding the leads so as to minimize shear deformation of the encapsulant.
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Graybill David E.
Tessera Inc.
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