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Selected: T

TAB package connecting host device element

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Tab semiconductor device having die edge protection and method f

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Tab semiconductor package with cushioned land grid array outer l

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Tab tape

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Patent

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Tab tape and semiconductor chip mounted on tab tape

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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TAB tape and semiconductor device including TAB tape

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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TAB tape semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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TAB type semiconductor device and method of manufacturing the sa

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Tape application platform and processes therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Tape application platform and processes therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Tape automated bonded (TAB) circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Tape automated bonding (TAB) semiconductor device with ground pl

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Tape automated bonding (tab) tapes having underlying camber supp

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Tape automated bonding film

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Tape automated bonding method and bonded structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Tape automated bonding type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Tape automated bonding(tab)semiconductor device and method for m

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Tape ball lead integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Tape carrier and assembly structure thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Tape carrier and tape carrier device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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