Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1996-12-17
1998-11-10
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257924, 257700, 257723, 257532, H01L 23495, H01L 2302, H01L 2334
Patent
active
058348328
ABSTRACT:
A packing structure for a surface mounting type semiconductor package, wherein at least one semiconductor chips are mounted on a die pad. A conductive pattern is formed on a printed circuit board which is located beneath an exposed side of a die pad of the package. A nonconductive thin film or a conductive layer is formed between the conductive pattern and the die pad. The conductive pattern is electrically connected to the die pad so that there is generated the package voltage difference therebetween, thereby reducing the electric noise of the package and facilitating high speed operation of the package without reducing a mounting density.
REFERENCES:
patent: 3880493 (1975-04-01), Lockhart, Jr.
patent: 4626958 (1986-12-01), Lockard et al.
patent: 4827327 (1989-05-01), Miyauchi et al.
patent: 4945399 (1990-07-01), Brown et al.
patent: 5028986 (1991-07-01), Sugano et al.
patent: 5065224 (1991-11-01), Fraser et al.
Lineback et al., "SMD Invasion of PC Boards Gains Headway", Electronics Week, pp. 17-18, Nov. 19, 1984.
Kim Jung Jin
Kweon Young Do
Lee Joung Rhang
Song Young Hee
Song Young Jae
Arroyo Teresa M.
Samsung Electronics Co,. Ltd.
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