Paddleless molded plastic semiconductor chip package

Details Paddleless molded plastic semiconductor chip package Paddleless molded plastic semiconductor chip package

1994-06-30

1997-02-18

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257712, 257713, 257787, 257796, H01L 23495

Patent

active

056043767

ABSTRACT:
Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased. within a plastic molded body, with the inactive back side of the chip exposed and facing outside the package.

REFERENCES:
patent: 5101324 (1992-03-01), Sato
patent: 5130889 (1992-07-01), Hamburgen et al.
patent: 5309026 (1994-05-01), Matsumoto
patent: 5394298 (1995-02-01), Sagisaka
patent: 5474958 (1995-12-01), Djennas et al.
Tanaka and Takeuchi, "Thermal Analysis of PQFP with High Thermal Dissipation", 1992 IEEE ECTC, pp. 332-339. No Month.
Djennas and Sterlin, "A Novel, Lower Cost, Thermally enhanced Exposed Silicon Plastic Package (ESPP)", 1994 IEEE ECTC, pp. 67-74. No Month.
Nakamura, Ohta, Nishioka, Tanaka, Ohizumi, Tabata, and Kohmoto, "Effects of Mechanical and Flow Properties of Encapsulating Resin on the Performance of Ultra Thin Tape Carrier Package", 1993 IEEE ECTC, pp. 419-424. No Month.
Joiner, Lin, McShane, Primeoiux, Youngblood, and Reinhardt, "Low Cost, Thermally Enhanced QFP", 1993 IEPC, pp. 471-478. No Month.

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