LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Use of a reference fiducial on a semiconductor package to...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Use of solder paste for heat dissipation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Use of tantalum oxide capacitor on ceramic co-fired technology

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Using a thermal barrier to provide a hermetic seal surface on al

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Using adhesive materials as insulation coatings for leadless...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Using external radiators with electroosmotic pumps for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Utilization of die active surfaces for laterally extending...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Utilization of die repattern layers for die internal connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Vacuum package fabrication of integrated circuit components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Vacuum package fabrication of integrated circuit components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling

Vacuum sealed microdevice packaging with getters

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Vacuum sealed package for semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Vapor chamber heat sink having a carbon nanotube fluid...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Variable rotational assignment of interconnect levels in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Variable rotational assignment of interconnect levels in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Variable-width lead interconnection structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Vented semiconductor device package having separate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Vertical ball grid array integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Vertical chip mount memory package with packaging substrate and