Variable rotational assignment of interconnect levels in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S296000, C438S130000, C438S128000, C382S296000, C382S298000, C382S300000

Reexamination Certificate

active

06849937

ABSTRACT:
Integrated circuit fabrication techniques are provided which allow non-horizontal
on-vertical wires to traverse the entire chip surface, rather than just the corners as in the conventional Manhattan geometry, while interconnecting circuit points. This is achieved by employing a variable rotational assignment methodology with respect to the interconnect layers or levels during the IC fabrication operation. These techniques thus eliminate the litho step problem, reduce interconnect distances and lessen the influence of capacitance interaction between interconnect wires.

REFERENCES:
patent: 4933846 (1990-06-01), Humphrey et al.
patent: 5541756 (1996-07-01), Chang-Hasnain et al.
patent: 5838036 (1998-11-01), Mori
patent: 6097855 (2000-08-01), Levien
patent: 6606576 (2003-08-01), Sessions
patent: 6674443 (2004-01-01), Chowdhuri et al.
patent: 20010022564 (2001-09-01), Youngquist et al.
patent: 20030219158 (2003-11-01), Crill
patent: 20040100469 (2004-05-01), Demers et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Variable rotational assignment of interconnect levels in... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Variable rotational assignment of interconnect levels in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Variable rotational assignment of interconnect levels in... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3477820

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.