Variable-width lead interconnection structure and method

Details Variable-width lead interconnection structure and method Variable-width lead interconnection structure and method

1996-10-31

1998-04-07

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257735, H01L 2348

Patent

active

057367841

ABSTRACT:
A variable-width lead interconnection structure disposed between a printed circuit board and a multichip module is presented. An edge clip with leads having a widened middle section is provided to optimize manufacturability and electrical performance. Each lead has a characteristic width and spacing of conventional leads where the leads are soldered to a multichip module or PCB. However, in between each end, each lead has a middle section that is widened to provide a characteristic impedance closer to the ideal 50 ohms, thus producing structures with better return loss at high frequencies.

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