Using a thermal barrier to provide a hermetic seal surface on al

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

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257706, H01L 2310

Patent

active

057708908

ABSTRACT:
A hermetically sealed microelectronic package that uses a thermal barrier or interposer between a cover and an aluminum nitride substrate. A solder interface is disposed on an aluminum nitride substrate, and the thermal barrier is disposed on the solder interface. The cover is attached to the solder interface using a solder seal that solders the cover to the interposer to produce a hermetically sealed package. The thermal barrier or interposer permits low cost, low temperature soldering of metal covers to metallized aluminum nitride substrate and is compatible with volume production processing.

REFERENCES:
patent: 5109268 (1992-04-01), Butera
patent: 5155661 (1992-10-01), Nagesh et al.
patent: 5159432 (1992-10-01), Ohkubo et al.
patent: 5168344 (1992-12-01), Ehlert et al.
patent: 5641713 (1997-06-01), Kyle

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