Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent
1997-02-25
1998-06-23
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
257706, H01L 2310
Patent
active
057708908
ABSTRACT:
A hermetically sealed microelectronic package that uses a thermal barrier or interposer between a cover and an aluminum nitride substrate. A solder interface is disposed on an aluminum nitride substrate, and the thermal barrier is disposed on the solder interface. The cover is attached to the solder interface using a solder seal that solders the cover to the interposer to produce a hermetically sealed package. The thermal barrier or interposer permits low cost, low temperature soldering of metal covers to metallized aluminum nitride substrate and is compatible with volume production processing.
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patent: 5641713 (1997-06-01), Kyle
Dreyer Gary A.
Kovacs Alan L.
Maish Kenneth G.
Alkov Leonard A.
Clark S. V.
Lenzen, Jr. Glenn H.
Raytheon Company
Saadat Mahshid D.
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