Vapor chamber heat sink having a carbon nanotube fluid...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S080300, C257SE21499, C257SE23097, C257SE23101, C257S706000, C257S707000, C257S721000, C438S122000, C977S932000

Reexamination Certificate

active

07732918

ABSTRACT:
An enhanced heat transposer comprised is of a vapor chamber. The surface of the vapor chamber that holds the fluid comprises an array of carbon nanotubes (CNTs) that are grown in a way that enables the fluid to come into maximum contact with the CNTs. The fluid evaporates in the sealed vapor chamber when it is in touch with a hot surface. The vapor comes in contact with a hollow pin-fin structure that provides additional surface area for vapor cooling and heat transfer. The condensed vapor then drops back into the fluid container, and the cycle continues.

REFERENCES:
patent: 4466618 (1984-08-01), Angelini
patent: 4932052 (1990-06-01), Lo
patent: 5060543 (1991-10-01), Warheit
patent: 5217094 (1993-06-01), Walter et al.
patent: 5713690 (1998-02-01), Corbin, Jr. et al.
patent: 5808236 (1998-09-01), Brezina et al.
patent: 5818700 (1998-10-01), Purinton
patent: 5837081 (1998-11-01), Ting
patent: 5932925 (1999-08-01), McIntyre
patent: 5965267 (1999-10-01), Nolan
patent: 5990552 (1999-11-01), Xie et al.
patent: 6156256 (2000-12-01), Kennel
patent: 6180874 (2001-01-01), Brezina et al.
patent: 6231744 (2001-05-01), Ying
patent: 6232706 (2001-05-01), Dai
patent: 6340822 (2002-01-01), Brown
patent: 6359288 (2002-03-01), Ying
patent: 6361861 (2002-03-01), Gao
patent: 6373703 (2002-04-01), Johnson et al.
patent: 6383923 (2002-05-01), Brown
patent: 6395991 (2002-05-01), Dockerty et al.
patent: 6407922 (2002-06-01), Eckblad
patent: 6417563 (2002-07-01), Halderman et al.
patent: 6432740 (2002-08-01), Chen
patent: 6449155 (2002-09-01), Colbert et al.
patent: 6504292 (2003-01-01), Choi
patent: 6591658 (2003-07-01), Yedur
patent: 6618251 (2003-09-01), Ishimine
patent: 6713151 (2004-03-01), Dean
patent: 6724906 (2004-04-01), Naksen et al.
patent: 6756026 (2004-06-01), Colbert
patent: 6800886 (2004-10-01), Awano
patent: 6821415 (2004-11-01), Sharb
patent: RE38677 (2004-12-01), Blomquist
patent: 6853068 (2005-02-01), Djekic
patent: 6855376 (2005-02-01), Hwang
patent: 6856016 (2005-02-01), Searls
patent: 6856511 (2005-02-01), Viernes et al.
patent: 6859367 (2005-02-01), Davison
patent: 6862962 (2005-03-01), Delbrugge et al.
patent: 6864571 (2005-03-01), Arik
patent: 6880799 (2005-04-01), Mrozek
patent: 6891724 (2005-05-01), De Lorenzo
patent: 6892652 (2005-05-01), Jalbert et al.
patent: 6900580 (2005-05-01), Dai
patent: 6910666 (2005-06-01), Burr
patent: 6921462 (2005-07-01), Montgomery
patent: 6924335 (2005-08-01), Fan
patent: 6955800 (2005-10-01), Resasco et al.
patent: 6962823 (2005-11-01), Empedocles
patent: 6965513 (2005-11-01), Montgomery
patent: 6989325 (2006-01-01), Uang
patent: 6998358 (2006-02-01), French et al.
patent: 7008604 (2006-03-01), Smalley
patent: 7011771 (2006-03-01), Gao
patent: 7029646 (2006-04-01), Margrave
patent: 7033647 (2006-04-01), Tang et al.
patent: 7052666 (2006-05-01), Colbert
patent: 2002/0090501 (2002-07-01), Tobita
patent: 2002/0100581 (2002-08-01), Knowles
patent: 2002/0130407 (2002-09-01), Dahl
patent: 2002/0145194 (2002-10-01), O'Connor
patent: 2002/0163079 (2002-11-01), Awano
patent: 2003/0111333 (2003-06-01), Montgomery
patent: 2003/0117770 (2003-06-01), Montgomery
patent: 2003/0231471 (2003-12-01), De Lorenzo
patent: 2004/0005736 (2004-01-01), Searls
patent: 2004/0013598 (2004-01-01), McElrath
patent: 2004/0053053 (2004-03-01), Jiang
patent: 2004/0101468 (2004-05-01), Liu
patent: 2004/0136161 (2004-07-01), Miyamura et al.
patent: 2004/0146560 (2004-07-01), Whiteford
patent: 2004/0150100 (2004-08-01), Dubin
patent: 2004/0152240 (2004-08-01), Dangelo
patent: 2004/0182600 (2004-09-01), Kawabata
patent: 2004/0184241 (2004-09-01), De Lorenzo
patent: 2004/0191158 (2004-09-01), Liu
patent: 2004/0218362 (2004-11-01), Amaro
patent: 2004/0261978 (2004-12-01), Zhan
patent: 2004/0261987 (2004-12-01), Zhang
patent: 2004/0265489 (2004-12-01), Dubin
patent: 2004/0266063 (2004-12-01), Montgomery
patent: 2004/0266065 (2004-12-01), Zhang
patent: 2005/0006754 (2005-01-01), Arik
patent: 2005/0037204 (2005-02-01), Osiander
patent: 2005/0046017 (2005-03-01), Dangelo
patent: 2005/0061496 (2005-03-01), Matabayas
patent: 2005/0067693 (2005-03-01), Nihei
patent: 2005/0092464 (2005-05-01), Leu
patent: 2005/0116336 (2005-06-01), Chopra
patent: 2005/0136248 (2005-06-01), Leu
patent: 2005/0139642 (2005-06-01), Koning
patent: 2005/0139991 (2005-06-01), White
patent: 2005/0150887 (2005-07-01), Taya
patent: 2005/0167647 (2005-08-01), Huang
patent: 2005/0224220 (2005-10-01), Li
patent: 2005/0238810 (2005-10-01), Scaringe
patent: 2005/0260412 (2005-11-01), Gardner
patent: 2005/0269726 (2005-12-01), Matabayas, Jr.
patent: 2008/0003801 (2008-01-01), Dubin et al.
patent: 2009/0065176 (2009-03-01), Hannah et al.
patent: 1329953 (2003-08-01), None
patent: WO 03/054958 (2003-07-01), None
patent: WO 03/072679 (2003-09-01), None
patent: WO 03/107419 (2003-12-01), None
Iijima, et al., “Single-shell carbon nanotubes of 1-nm diameter”, Nature 363, 603 (1993).
Baughman, et al.; “Carbon Nanotubes—the Route Toward Applications”, W A, Science 297, 787 (2002).
Wong, et al.; “Nanobeam Mechanics: Elasticity, Strength, and Toughness of Nanorods and Nanotubes”, Science 277, 1971 (1997).
Yu, et al.; “Tensile Loading of Ropes of Single Wall Carbon Nanotubes and their Mechanical Properties”, Phys. Rev. Lett. 84 5552 (2000).
Odom, et al.;“Atomic structure and electronic properties of single-walled carbon nanotubes”, Nature 391, 62 (1998).
Wildoer, et al.;“Electronic structure of Atomically resolved carbon nanotubes”, Nature, 391, 59(1998).
Li, J. et al. “Bottom Up Approach for Carbon Nanotube Interconnects.” Applied Phys. Letters, American Institute of Physics, Apr. 18, 2003, pp. 2491-2493, vol. 82, No. 15.
Baughman, et al.;“Carbon Nanotube Actuators” , Science 284, 1340 (1999).
Star. et al; “Nano Optoelectronic Memory Devices”, Nano Lett. 4, 1587 (2004).
Lee, et al.;“Bandgap Modulation of Carbon Nanotubes by Encapsulated Metallofullerenes”, pp. 1005-1008.
Collins, et al.; “Engineering Carbon Nanotubes and Nanotube Circuits Using Electrical Breakdown”, Science 292, 706 (2001).
Bachtold, et al.; “Logic Circuits with Carbon Nanotube Transistors”, Science 294, 1317 (2001).
Koehne, et al.;“Ultrasensitive label-free DNA analysis using an electronic chip based on carbon nanotube nanoelectrode arrays”, Nanotechnology, 14 , 1239 (2003).
Kong, et al.; “Nanotube Molecular Wires as Chemical Sensors”, Science 287, 622 (2000).
Li, et al.;“Carbon Nanotube Sensors for Gas and Organic Vapor Detection”, Nano Lett. 3, 929 (2003).
Novak, et al.;“Nerve agent detection using networks of single-walled carbon nanotubes”, Appl. Phys. Lett. 83, 4026 (2003).
Ruoff, et al.; “Mechanical and Thermal Properties of Carbon Nanotubes”, Carbon 33, 925 (1995).
Fujii, et al.;“Measuring the Thermal Conductivity of a Single Carbon Nanotube”, Phys. Rev. Lett. 95, 065502 (2005).
Kim, et al.; “Thermal Transport Measurements of Individual Multiwalled Nanotubes”, Phys. Rev. Lett.87 215502 (2001).
Pop, et al.;“Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature”, Nano Lett. 6, 96 (2006).
Xu, et al.; “Enhancement of Thermal Interface Materials with Carbon Nanotube Arrays,” International Journal of Heat and Mass Transfer, vol. 49, pp. 1658-1666, (2006).
Yu, et al.; “Thermal Contact Resistance and Thermal Conductivity of a Carbon Nanofiber”,J. Heat. Tran.2006, 128, 234.
Wang, et al.; “Photo-Acoustic Measurement of Thermal Conductivity of Thin Films and Bulk Materials”, ASME, J. Heat Transfer, 123, 138 (2001).
Dresselhaus, et al.;“Raman spectroscopy on one isolated carbon nanotube”, Physica B. 232, 15 (2002).
Dresselhaus, et al.; “Phonons in carbon nanotubes”, Adv. Phys. 49, 705 (2000).
Markutsya, et al.; “Freely Suspended Layer-by-layer Nanomembranes: Testing Micrormec

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Vapor chamber heat sink having a carbon nanotube fluid... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vapor chamber heat sink having a carbon nanotube fluid..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vapor chamber heat sink having a carbon nanotube fluid... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4152350

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.