Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-01-31
2006-01-31
Tran, Mai-Huong (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C361S699000, C165S104110, C417S313000
Reexamination Certificate
active
06992381
ABSTRACT:
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.
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List et al., U.S. Appl. No. 10/402,435, filed Mar. 28, 2003, entitled “Electroosmotic Pump Using Nanoporous Dielectric Frit”.
Kim et al., U.S. Appl. No. 10/669,205, filed Sep. 24, 2003, entilted “Integrated Re-Combiner for Electroosmotic Pumps Using Porous Frits”.
Kim et al., U.S. Appl. No. 10/687,127, filed Oct. 16, 2003, entitled “Electroosmotic Pumps Using Porous Frits for Cooling Integrated Circuit Stacks”.
Kim et al., U.S. Appl. No. 10/323,084, filed Dec. 18, 2002, entitled “Electro-Osomotic Pumps and Micro-Channels”.
Kim Sarah E.
List R. Scott
Mahajan Ravi
Maveety James G.
Myers Alan M.
Tran Mai-Huong
Trop Pruner & Hu P.C.
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