Universal substrate for a semiconductor device having...

Details Universal substrate for a semiconductor device having... Universal substrate for a semiconductor device having...

2007-02-23

2009-10-20

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23067, C257SE23070, C257SE23125, C257SE23149, C257S668000, C257S728000, C257S698000, C257S690000, C257S691000, C257S692000

Reexamination Certificate

active

07605462

ABSTRACT:
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses are connected with the bifurcate wirings in series. By the bifurcate wirings and the fuses, each of the inner pads is electrically connected to all of the outer pads to provide optional electrical disconnections therebetween. Accordingly, the universal substrate can provide for various chips with different serial arrangements of bonding pads without replacing or manufacturing another kind of substrate.

REFERENCES:
patent: 5809312 (1998-09-01), Ansel et al.
patent: 6410366 (2002-06-01), Hashimoto
patent: 6815808 (2004-11-01), Hyodo et al.
patent: 2003/0020155 (2003-01-01), Shinonaga et al.
patent: 2005/0157557 (2005-07-01), Perlov et al.

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