Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1999-01-13
2000-06-20
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257774, 257776, H01L 2348, H01L 2352, H01L 2940
Patent
active
060781009
ABSTRACT:
The formation of routing traces on an external surface of a semiconductor device, such as a flip-chip, which has a plurality of ball or bump sites patterned in specific locations, wherein the ball or bump sites are in electrical communication with external communication traces which are used to route signals from the flip-chip integrated circuitry. Such external communication traces generally result in unused space on the exterior surface of the flip-chip. This unused space can be utilized for forming routing traces to connect portions of the internal circuitry of the flip-chip rather than forming such routing traces internally, for forming routing traces to connect two or more semiconductor dice, or for forming routing traces for use as repair mechanisms.
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patent: 5523626 (1996-06-01), Hayashi et al.
patent: 5534465 (1996-07-01), Frye et al.
patent: 5904556 (1999-05-01), Suzuki et al.
Duesman Kevin G.
Farnworth Warren M.
Clark Jhihan B.
Micro)n Technology, Inc.
Saadat Mahshid
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