Vacuum package fabrication of integrated circuit components

Details Vacuum package fabrication of integrated circuit components Vacuum package fabrication of integrated circuit components

2005-04-12

2005-04-12

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S684000, C257S678000, C438S106000, C438S456000

Reexamination Certificate

active

06879035

ABSTRACT:
A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.

REFERENCES:
patent: 5388443 (1995-02-01), Manaka
patent: 5415726 (1995-05-01), Staller et al.
patent: 5701008 (1997-12-01), Ray et al.
patent: 5915168 (1999-06-01), Salatino et al.
patent: 6018380 (2000-01-01), Hu et al.
patent: 6036872 (2000-03-01), Wood et al.
patent: 6062461 (2000-05-01), Sparks et al.
patent: 6303976 (2001-10-01), Gaitan et al.
patent: 6479320 (2002-11-01), Gooch
patent: 6521477 (2003-02-01), Gooch et al.
patent: 6537892 (2003-03-01), Jordan et al.
patent: 6586831 (2003-07-01), Gooch et al.
patent: 20020106862 (2002-08-01), Jordan et al.
patent: 0 794 558 (1997-09-01), None
PCT Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration mailed Sep. 15, 2004, regarding PCT/US 2004/012131 filed Apr. 19, 2004 (12 pages).

Affiliated with

Also associated with

Rating

Vacuum package fabrication of integrated circuit components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vacuum package fabrication of integrated circuit components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vacuum package fabrication of integrated circuit components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3409836