Use of tantalum oxide capacitor on ceramic co-fired technology

Details Use of tantalum oxide capacitor on ceramic co-fired technology Use of tantalum oxide capacitor on ceramic co-fired technology

1996-11-27

1997-09-09

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257700, 257730, H01L 2334

Patent

active

056660049

ABSTRACT:
An electronic package which contains a tantalum oxide capacitor that couples a conductive bottom surface of an integrated circuit to a plurality of conductive lines within the housing of the package. The conductive lines are connected to pins which provide power and ground to the integrated circuit. The pins and conductive lines are also coupled to a number of junctions located on the top surface of the die, by a plurality of wires. The package couples both the top and bottom surfaces of the integrated circuit to the power and ground pins of the package.

REFERENCES:
patent: 4458295 (1984-07-01), Durschlag et al.
patent: 5008734 (1991-04-01), Dutta et al.
patent: 5177670 (1993-01-01), Shinohara et al.
Bell, S.A., et al. "Hybrid Tantalum Chip Capacitors," International Microelectric Symposium, 1972 pp. 4A11-4A16.

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