Coaxial through chip connection
Cobalt silicidation using tungsten nitride capping layer
Cobalt silicide formation method employing wet chemical...
Cobalt silicide structure for improving gate oxide integrity...
Cobalt titanium oxide dielectric films
Cobalt/nickel bi-layer silicide process for very narrow line...
Collar positionable about a periphery of a contact pad and...
Collar positionable about a periphery of a contact pad and...
Collimated deposition of titanium onto a substantially vertical
Collimated sputtering of semiconductor and other films
Combined barrier layer and seed layer
Combined conformal/non-conformal seed layers for metallic...
Combined gate cap or digit line and spacer deposition using HDP
Combined in-situ high density plasma enhanced chemical vapor dep
Combined resist strip and barrier etch process for dual...
Compact semiconductor structure
Completely buried contact holes and methods of forming same
Completely removal of TiN residue on dual damascence process
Compliant test probe with jagged contact surface
Compliant wirebond pedestal