Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-01-30
2007-01-30
Linsay, Jr., Walter L. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S613000, C438S614000
Reexamination Certificate
active
10446384
ABSTRACT:
Dielectric collars to be disposed around contact pads on a surface of a semiconductor device or another substrate and methods of fabricating and disposing the collars on semiconductor devices and other substrates are disclosed. Semiconductor devices including the collars and having contact pads exposed through the collars are also disclosed. One or more of the collars are disposed around the contact pads of a semiconductor device or other substrate before or after conductive structures are secured to the contact pads. Upon connecting the semiconductor device face down to a higher level substrate and establishing electrical communication between contact pads of the semiconductor device and contacts pads of the substrate, the collars prevent the material of conductive structures protruding from the semiconductor device from contacting regions of the surface of the semiconductor device that surround the contact pads thereof. The collars may be preformed structures which are attached to a surface of a semiconductor device or other substrate. Alternatively, the collars can be fabricated on the surface of the semiconductor device or other substrate. A stereolithographic method of fabricating the collars is disclosed. The stereolithographic method may include use of a machine vision system including at least one camera operably associated with a computer controlling a stereolithographic application of material so that the system may recognize the position and orientation of a semiconductor device or other substrate on which the collar is to be fabricated.
REFERENCES:
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5278442 (1994-01-01), Prinz et al.
patent: 5281684 (1994-01-01), Moore et al.
patent: 5484314 (1996-01-01), Farnworth
patent: 5545367 (1996-08-01), Bae et al.
patent: 5608260 (1997-03-01), Carper et al.
patent: 5641113 (1997-06-01), Somaki et al.
patent: 5705117 (1998-01-01), O'Connor et al.
patent: 5834366 (1998-11-01), Akram
patent: 5915170 (1999-06-01), Raab et al.
patent: 5924003 (1999-07-01), Slocum
patent: 5934545 (1999-08-01), Gordon
patent: 5977632 (1999-11-01), Beddingfield
patent: 6013571 (2000-01-01), Morrell
patent: 6110760 (2000-08-01), Medlen et al.
patent: 6118179 (2000-09-01), Farnworth et al.
patent: 6143639 (2000-11-01), Medlen et al.
patent: 6180504 (2001-01-01), Farnworth et al.
patent: 6191489 (2001-02-01), Igel et al.
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6274473 (2001-08-01), Blish, II et al.
patent: 6274474 (2001-08-01), Caletka et al.
patent: 6297141 (2001-10-01), Miyazaki
patent: 6297560 (2001-10-01), Capote et al.
patent: 6297562 (2001-10-01), Tilly
patent: 6326698 (2001-12-01), Akram
patent: 6333104 (2001-12-01), Perry et al.
patent: 6344695 (2002-02-01), Murayama
patent: 6352881 (2002-03-01), Nguyen et al.
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6461881 (2002-10-01), Farnworth et al.
patent: 6476502 (2002-11-01), Yamada et al.
patent: 6506671 (2003-01-01), Grigg
patent: 6524346 (2003-02-01), Farnworth
patent: 6525408 (2003-02-01), Akram et al.
patent: 6544821 (2003-04-01), Akram
patent: 6548897 (2003-04-01), Grigg
patent: 6583354 (2003-06-01), Alcoe
patent: 6630365 (2003-10-01), Farnworth et al.
patent: 6649444 (2003-11-01), Earnworth et al.
patent: 2002/0043711 (2002-04-01), Akram et al.
patent: 2002/0171177 (2002-11-01), Kritchran et al.
patent: 2003/0022452 (2003-01-01), Farnworth et al.
patent: 2003/0043360 (2003-03-01), Farnworth
patent: 2003/0089999 (2003-05-01), Akram
patent: 2003/0092220 (2003-05-01), Akram
patent: 2003/0102566 (2003-06-01), Farnworth
patent: 2003/0139030 (2003-07-01), Grigg
patent: 2003/0151167 (2003-08-01), Krichman et al.
patent: 2003/0170921 (2003-09-01), Akram
patent: 2003/0173665 (2003-09-01), Grigg
patent: 2003/0176016 (2003-09-01), Grigg
patent: 2003/0207213 (2003-11-01), Farnworth
Miller et al., “Maskless Mesoscale Materials Deposition”, Deposition Technology, Sep. 2001, pp. 20-22.
Miller, “New Laser-Directed Deposition Technology”, Microelectronic Fabrication, Aug. 2001, p. 16.
Webpage, Objet Prototyping the future, Objet FullCure700 Series, 1 page.
Webpage, Objet Prototyping the future, Objet How it Works, 2 pages.
U.S. Appl. No. 09/590,527, filed Jun. 8, 2000, entitled “Structures for Stabilizing Semiconductor Devices Relative to Test Substrates and Methods for Fabricating the Stabilizers”, inventor Salman Akram.
U.S. Appl. No. 09/590,621, filed Jun. 8, 2000, entitled “Sterolithographic Method and Apparatus for Fabricating Subilizers for Flip-Chip Type Semiconductor Devices and Resulting Structures”, inventor Akram et al.
U.S. Appl. No. 09/590,646, filed Jun. 8, 2000, entitled “Reinforced, Self-Aligning Conductive Structures for Semiconductor Device Components and Methods for Fabricating Same”, inventor Williams et al.
U.S. Appl. No. 10/201,208, filed Jul. 22, 2002, entitled “Thick Solder Mask for Confining Encapsulant material Over Selected locations of a Substrate, Assemblies Including the Solder Mask, and Methods”, inventor Grigg et al.
U.S. Appl. No. 10/672,098, filed Sep. 26, 2003, entitled “Apparatus and Methods for Use in Sterolithographic Processing of Components and Assemblies”, inventor Warren M. Famworth.
U.S. Appl. No. 10/688,354, filed Oct. 17, 2003, entitled “Thick Solder Mask For Confining Encapsulant Material Over Selected Locations of a Substrate and Assemblies Including the Solder Mask”, inventor Grigg et al.
Ahmad Syed Sajid
Akram Salman
Linsay, Jr. Walter L.
Micro)n Technology, Inc.
TraskBritt
LandOfFree
Collar positionable about a periphery of a contact pad and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Collar positionable about a periphery of a contact pad and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Collar positionable about a periphery of a contact pad and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3814622