Coaxial through chip connection

Details Coaxial through chip connection Coaxial through chip connection

2007-01-02

2007-01-02

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S386000, C438S459000, C438S618000, C438S597000, C438S598000, C257SE23067, C257SE23174, C257SE21575, C257SE21627, C257SE21641

Reexamination Certificate

active

11329953

ABSTRACT:
A method performed on a wafer having multiple chips, each including a doped semiconductor and substrate, involves etching an annulus trench partially into the substrate, metalizing the annulus trench with a metal, etching a via trench within the periphery of the annulus trench, making a length of the via trench electrically conductive, and thinning the substrate to expose the metal and the electrically conductive material.

REFERENCES:
patent: 3312878 (1967-04-01), Springfield et al.
patent: 5229315 (1993-07-01), Jun et al.
patent: 5308784 (1994-05-01), Kim et al.
patent: 5587119 (1996-12-01), White
patent: 5608264 (1997-03-01), Gaul
patent: 6770822 (2004-08-01), Pasternak et al.
patent: 2002/0017399 (2002-02-01), Chang et al.
patent: 2002/0094675 (2002-07-01), Kerr et al.
patent: 2002/0127761 (2002-09-01), Mottura et al.
patent: 2002/0134581 (2002-09-01), Figueroa et al.
patent: 2003/0085471 (2003-05-01), Iijima et al.
patent: 2003/0159262 (2003-08-01), Pastemak et al.
patent: 2004/0256686 (2004-12-01), Sassolini et al.
patent: 2005/0046034 (2005-03-01), Farrar

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